Deadline: June 30, 2014
iLEAP is now accepting applications from Southeast Asian social leaders to participate in the 2014 iLEAP International Fellowship program in Seattle, Washington, USA. This is an eight-week intensive leadership training that runs from October 20, 2014 to December 12, 2014. The iLEAP International Fellowship (IF) is a long-term investment in community-based leadership in Asia, Africa, and Latin America.
Fellowship Details
Each year, iLEAP selects up to 15 grass-roots leaders from around the world from a highly competitive, global pool of applicants to join a unique, cross-cultural and global leadership training in Seattle. Finalists join an international cohort of up to 15 iLEAP Fellows from Asia, Africa, and Latin America. Finalists will also play a key role in the growth of the iLEAP Southeast Asia Leadership Initiative. For more information on the programs, visit www.iLEAP.org.
This fellowship covers all participation costs, including round-trip airfare to/from Seattle, room/board, visa/immigration, transportation, living stipend, and all program related expenses.
Eligibility
Competitive applicants will meet all of the following criteria:
- Living and working full-time in one or more of the following countries: Thailand, Cambodia, Myanmar, Laos, Vietnam, Indonesia, Timor Leste, Malaysia, Singapore, Brunei, Papua New Guinea, or the Philippines. Preference will be given to citizens of these countries.
- Five or more years working in a leadership position in NGO/CBO or socially minded business.
- Clear understanding of both the iLEAP International Fellowship program and Southeast Asia Leadership Initiative and how both will benefit the applicant’s personal growth and social leadership.
- Demonstrated long-term commitment to the Southeast Asia region.
- Interest in building a network of aligned social leaders in the Southeast Asia region.
- Between 25-42 years of age.
- Intermediate or higher level of English conversation skills.
- Available in the fall of 2014 to travel to Seattle, WA USA
For more information, click here.
